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Opening paragraph issues

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I have a couple of issues with the opening paragraph:

  1. Mentioning the term "chiplet." It irks me the source is another wiki that's editable by anyone.
  2. Enough mentioning of Intel and AMD makes it feel like there's a bias towards those two companies pioneering the manufacturing paradigm, even though MCM manufacturing has been around for decades as noted by the examples.

ShuffyIosys (talk) 22:15, 7 December 2020 (UTC)[reply]

ShuffyIosys is correct. "Chiplet" is a relatively modern term taken from a particular design approach to MCMs. In fact, the Power5 MCM that leads off the article does not use chiplets, it uses chips that were designed to be packaged and used separately.

Chiplets are generally single-function devices (such as a group of CPU cores, a GPU, a collection of I/O interfaces, etc.), smaller than complete standalone chips (particularly, small enough that die size does not substantially affect fab yield), and optimized for use only on an MCM substrate (for example, using I/O cells that will work only over short distances on a substrate and not over longer distances on an ordinary PC board). The topic of chiplets deserves a section of its own in this article, but it is wrong for the article to say that MCMs necessarily use chiplets. 67.188.1.213 (talk) 21:57, 20 January 2021 (UTC)[reply]

After some research, I found from https://www.eetimes.com/chiplets-a-short-history/ that the term had been in circulation as early as 1969 from a patent, and apparently there was a spike in the search term on Google in 2004. However, I've found the distinction that chiplets are ICs that must be integrated together to form a larger component and cannot standalone is a common thread among the industry. ShuffyIosys (talk) 16:07, 26 April 2021 (UTC)[reply]

Opening heading

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A system in a package and MCM are different. A Pentium D is a MCM but is far from a system in a package. The picture of a Power5 is another example. — Preceding unsigned comment added by 71.132.158.50 (talk)

Requested move

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The following discussion is an archived discussion of a requested move. Please do not modify it. Subsequent comments should be made in a new section on the talk page. No further edits should be made to this section.

The result of the move request was: page moved. Vegaswikian (talk) 20:43, 13 December 2010 (UTC)[reply]



Multi-Chip ModuleMulti-chip module — thats how it is — Preceding unsigned comment added by Frap (talkcontribs)

The above discussion is preserved as an archive of a requested move. Please do not modify it. Subsequent comments should be made in a new section on this talk page. No further edits should be made to this section.
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Trimming examples

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I feel the list of examples is becoming one of those "throw in anything!" kind of things, regardless of notability (which of course is subject to opinion.

I think we should limit it to general types of uses of MCM, such as "processor + external cache" as in the Pentium Pro/2 or POWER5, Intel Feveros, HBM processors, among others and keep specific examples of each to maybe 2-3. ShuffyIosys (talk) 15:40, 29 July 2024 (UTC)[reply]